Manufacturing:

• 2 rotary heads on dual linear X/Y gantrieswith 8 and 12 pick ups & a 40 position ‘smart’ nozzle bank per head
• Placement rate 26 300 cph (IPC: 22 030 cph)
• Component placement from 01005 to 50x50mm
• Component lead pitch 0.3mm (QFP), 0.4mm (µBGA)
• Component lead size 0.15mm (QFP), 0.2mm (µBGA)
• Accuracy, standard 35µm (QFP) to 50µm (Chip)
• up to 264 8mm feeders plus 3 Jedec trays
• Max PCB size 700 x 460mm

TSM A70-j82S 8 zone reflow oven

• 8 heating zones top and bottom 2 cooling zones
• Heated length 2.2m
• Conveyor speed 0.3 – 1.6m/min
• Chain conveyor with anti warp support
• Temperature accuracy ±1ºC

• PCB unloader PCB unloader mechanism
• 3 off R-808 racks (535 x 460 x 570 mm)
• Max PCB size 535 x (50-390mm)

DCB Automation Ultravision AOI

• 4M pixel colour CCD camera providing 10.6µM resolution suitable for 01005 components
• Telecentric Lens to ensure no distortion of image.
• Laser Co-planarity capability for BGA and IC lead inspection (automatic lead height profile) now providing the highest level of performance from a bench top AOI system; as standard
• Standard inspection area 470mm x 450mm
• 3 tier coloured LED lighting for accurate solder inspection
• Database connectivity for statistical reporting.
• Off-line software included for programming and rework facility
• UK designed and manufactured